Heidelberg Instruments with its maskless lithography systems is well positioned for that demand. In 2025 will be tested a ...

Summary Taiwan’s Economic Minister J.W. Kuo reaffirmed that TSMC needs government approval for overseas joint ventures but faces no restrictions on advanced chip production outside China. Amid ...

Summary Dell’s stock has surged over the past two years, fueled by booming AI server sales, but shares are down slightly in 2025. The company reported strong AI-driven revenue growth but missed ...

Nvidia CEO shakes off DeepSeek effect, says ‘new scaling law’ driving demand: Summary Nvidia CEO Jensen Huang dismissed concerns about slowing GPU demand, citing “extraordin ...

Arm eyes expansion in Korea with AI chip designs for IoT devices: Summary Arm unveiled its Armv9 Edge AI platform in Korea, enhancing AI capabilities for IoT devices. The platform ...

Amazon touts its first quantum computing chip a week after Microsoft’s unveiling: Summary Amazon unveiled its first quantum computing chip, Ocelot, aiming to advance scalable qu ...

Summary Fear drives many EDA tool purchases, especially in chip verification, where mistakes can cost millions. Companies balance costs and risk, relying on aut ...

Summary AI is blurring the lines between supercomputers and high-performance computing (HPC), driving massive performance gains. Both now rely on high-bandwidth memory, fast interconnects, and GPUs ...

Summary Big Tech's AI spending will surpass $250 billion in 2025, with infrastructure as the primary focus. By 2029, global AI infrastructure investments will hit $423 billion. As AI models demand ...

Of New HPC Chip Designs Will Be Multi-Die In 2025: Summary The semiconductor industry is shifting from monolithic chips to multi-die and chiplet-based designs ...

Nvidia warns of growing competition from China’s Huawei, despite U.S. sanctions: Summary Nvidia has flagged Huawei as a key competitor despite U.S. restrictions, listing it in f ...

Summary The surge in multi-die chiplet designs is flooding engineers with massive data loads, complicating design, simulation & testing. Growing interoperability challenges, evolving standards, and AI ...